University of Houston researchers have made a groundbreaking discovery in thermal conductivity, overturning an existing theory that boron arsenide (BAs) couldn’t compete with the heat conduction of a ...
PITTSBURGH, Dec. 18, 2025 /PRNewswire/ -- NovoLINC, a leader in advanced thermal interface material (TIM) solutions for high-performance computing, today announced the closing of an oversubscribed ...
As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...
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